We Participated in the 26th International Hi-Tech Fair
It is the 2nd time for us to participate in Hi-Tech Fair after a year, focusing on a series of latest technological achievements in the development of bismuth, high purity copper and thermal interfaces, totaling more than 12 kinds of cutting-edge new materials and products.
We exhibited indium foil, copper foil, liquid metal thermal conductive sheet, thermal conductive paste and other products. Liquid metal thermal interface materials break through the performance limit of traditional thermal conductive materials. It has shown great application prospects in consumer electronics thermal management, automotive power battery thermal management and laser devices.
Our high enthalpy phase change materials have high energy density, high thermal stability and excellent cycling performance. They can realize efficient storage and release of energy, bringing revolutionary breakthroughs in the fields of energy storage, energy conversion and efficient utilization. It provides a brand new solution for aerospace, new energy vehicles, power storage and other fields.
The new product, lead-free flexible X-ray shielding material, adopts polymer composite technology and environmentally friendly inorganic fillers, realizing the material’s lightweight, flexibility and high shielding, effectively replacing the traditional lead-containing materials and providing safer and more environmentally friendly X-ray protection for medical and industrial fields.
As a the fastest growing rare metal supplier, we have been committed to promoting the research, development and application of production technology, breaking through technological bottlenecks, expanding application fields, and contributing to the progress of the global science and technology industry in a sustainable way.
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