We Participated in the 25th International Hi-Tech Fair
As a high-tech enterprise specializing in the production of rare metals and thermal interface materials, we participated in this year’s Hi-Tech Fair, focusing on a series of latest technological achievements in the development of bismuth, tellurium and thermal interfaces, totaling more than 10 kinds of cutting-edge new materials and products.
We exhibited bismuth powder, tellurium powder, copper powder, liquid metal thermal conductive sheet, thermal conductive paste and other products. Due to the super high thermal conductivity and convenient use of liquid metal thermal paste, it gained the praise and attention of many customers in the thermal management industry.
Our new product, high enthalpy phase change material, is a composite material prepared based on the derivation of low melting point alloy technology, which has the characteristics of large latent heat of phase change per unit volume, small temperature gradient within the phase change material, and small volume change after the phase change.
Our bismuth-based, indium-based, tin-based and other alloys T6, T7, T8 ultrafine spherical powder series products, under the premise of completely independent intellectual property rights, has been tin-based, bismuth-based, indium-based spherical powder to T8 level, breaking the long-term monopoly of foreign countries.
In the future, we will continue to focus on the research and development of rare metal materials and their thermal interface materials, develop more products with more market competitiveness, and flourish together with the rare metal industry.
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